Newsletter Archive
| Date | Key Points |  |
|---|---|---|
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Mar 2012 |
Lamar sign agreement to represent Coatema |
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Dec 2011 |
5 & 9 micron copper foil without a copper carrier |
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Sep 2011 |
Lamar to exhibit at Productronica 2011 |
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Jun 2011 |
Zot convert to Taiyo IJR4000 MW300 ink jet printing ink |
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Mar 2011 |
Lamar launch new website |
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Nov 2010 |
Zot Engineering converts to Taiyo Soldermask |
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Apr 2010 |
Lamar 25th Anniversary |
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Dec 2009 |
KSM Superclean Hand Tools improve yields |
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July 2009 |
Electroless Nickel Immersion Gold from Uyemura |
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Mar 2009 |
New Low Dielectric Constant Laminate from Panasonic |
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Jan 2009 |
New Laser Direct Imageable Soldermask from Taiyo |
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Dec 2008 |
Permanent Hole Plugging Ink from Taiyo |
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Jul 2008 |
Lamar add NTS Process and Dry Film Chemicals to product list |
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Nov 2007 |
Lamar signs new agreement with Umicore |
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May 2007 |
Adhesiveless Flexible Laminates from Panasonic |
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Feb 2007 |
High Performance Drill Entry Boards |
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Dec 2006 |
Low Cost Thin Stainless Steel Separators |
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May 2006 |
Panasonic R1755 High Tg Laminate for Lead-Free Processing |
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Mar 2006 |
Nelco -29 High Tg Laminate for Lead-Free Processing |
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Nov 2005 |
Lamar add High Temp Release Film to product list |
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Jun 2005 |
Nelco Polyimide added to product list |
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Apr 2005 |
Problem solving for blind and buried via Lamination |
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Feb 2005 |
New distributor agreements with Nelco & Panasonic |
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